Bewerber:
Prof. Dr. Schwarz, Fachhochschule Eberswalde, Deutschland
Dr. Hendrik Wust, Dr. Michael Oertel, Technische Universität Dresden, Deutschland
Dr. Günter Wiedemann, Fraunhofer Institut für Werkstoff- und Strahltechnik, Deutschland

Abstract:
The glue application system for is one of the most important units regarding the edge processing. After heating the hot melts are applied on the board or the edge material using a special roll. This process is very intensive concerning energy and time. The melting of the glue with laser allows a direct positioned energy placement. So there is no energy necessary for the permanent heating of the glue container. The arranged investigations show that standard glues can be melt using laser and the adhesion of the coating material and the board can be realized under production conditions. Using the new bonding technology good bonding strength are achieved. Increasing the process speed will be possible, too.